Senior Design Project 2020
My work with Keysight Technologies through UC DavisThe Problem
Keysight Technologies has upgraded their eutectic soldering machines to be automated, but are experiencing higher failure rates that are acceptable with these new machines. Our job as a senior design team was to formulate a process solution to Keysight Technologies current eutectic die bond machine that would lower failure rates.
Our Solution
When we started the project, we expected to deliver a experimentally tested process that would lower failure rates, but due to COVID-19, we actually ended up delivering a software solution that would estimate the stability of the process based on the diffusion of Gold into the Gold-Tin Solder from the outer layers. This allowed Keysight Technologies to test any theoretical process using our code and find the heat of melting in the actual heat of melting in the solder based on the deviation in the melting temperature from the phase diagram of Gold-Tin
Our Results
In the end, we produced a piece of software that correctly estimated the melting temperature of the eutectic die bond based on the inputs of Preheat time and temperature, Dwell time and temperature, and initial composition. Based on this, Keysight engineers are able to alter their process to avoid their largest reason for die bond failiure, premature solidification.
